The model "K4A4G165WF-BCTD" is a part from Samsung Electronics, specifically a DRAM (Dynamic Random Access Memory ). This part belongs to the DDR3 SDRAM family. Let's break down the requirements for your request step by step:
Pin Function Specifications:
The K4A4G165WF-BCTD package is a DDR3 SDRAM component. The pin function specification will include details on how each pin connects to the memory controller and other parts of the system. Below is an in-depth explanation of what you are asking for, focusing on the typical pinout for such DRAM ICs.
For the purpose of providing a complete answer, I will follow the structure below:
1. Package Type
The K4A4G165WF-BCTD model is commonly packaged in a FBGA (Fine-pitch Ball Grid Array) package. The typical size for these types of devices could be 96-ball FBGA or 78-ball FBGA (depending on exact configuration), but I would need to check the exact datasheet to clarify the number of balls and the type.2. Pin Function List (Example of 96-Ball FBGA)
Assuming this is a 96-ball FBGA with a ball pitch of 0.8mm, here is the list of pins and their respective functions:
Pin Number Pin Name Pin Function Description 1 A0 Address Line 0 (LSB) 2 A1 Address Line 1 3 A2 Address Line 2 4 A3 Address Line 3 5 A4 Address Line 4 6 A5 Address Line 5 7 A6 Address Line 6 8 A7 Address Line 7 9 A8 Address Line 8 10 A9 Address Line 9 11 A10 Address Line 10 12 A11 Address Line 11 13 A12 Address Line 12 14 A13 Address Line 13 15 A14 Address Line 14 16 A15 Address Line 15 (MSB) 17 BA0 Bank Address Line 0 18 BA1 Bank Address Line 1 19 BA2 Bank Address Line 2 20 VSS Ground Pin 21 VDD Power Pin 22 CK Clock Input (positive edge) 23 CK# Clock Input (negative edge) 24 CKE Clock Enable 25 CS# Chip Select (active low) 26 RAS# Row Address Strobe (active low) 27 CAS# Column Address Strobe (active low) 28 WE# Write Enable (active low) 29 DM0 Data Mask (for byte 0) 30 DM1 Data Mask (for byte 1) 31 DQ0 Data Input/Output (bit 0) 32 DQ1 Data Input/Output (bit 1) … … … 94 VDDQ Supply Voltage for I/O 95 VSSQ Ground for I/O 96 NC No Connection (Reserved)Note: This is just an example of how pinout information would be presented. Depending on the specific part, the ball grid array can have more or fewer pins, and specific names/labels might differ.
3. Common Questions (FAQ)
Here are the top 20 frequently asked questions about K4A4G165WF-BCTD or similar DRAM module s, explained in a Q&A format:
1. What type of memory is K4A4G165WF-BCTD? Answer: The K4A4G165WF-BCTD is a DDR3 SDRAM module, designed for high-speed data access in computers and embedded systems. 2. What is the voltage requirement for the K4A4G165WF-BCTD? Answer: The typical operating voltage for the K4A4G165WF-BCTD is 1.5V. 3. How many pins does K4A4G165WF-BCTD have? Answer: The K4A4G165WF-BCTD is typically available in a 96-ball FBGA package. 4. What does CK stand for in the pinout? Answer: CK stands for Clock. It is the clock signal input used to synchronize the read/write operations of the memory. 5. What does RAS# represent? Answer: RAS# stands for Row Address Strobe. It is used to latch the row address during memory access. 6. What does CAS# represent? Answer: CAS# stands for Column Address Strobe. It is used to latch the column address during memory access. 7. What is the purpose of WE#? Answer: WE# stands for Write Enable. It signals when a write operation is active (low level). 8. What is the role of the CS# pin? Answer: CS# stands for Chip Select. It is used to enable or disable the memory device. 9. What is the significance of DM pins? Answer: The DM pins (such as DM0, DM1) are used for Data Mask during write operations to mask specific data bits. 10. What does the VDDQ pin signify? Answer: VDDQ provides the supply voltage for the input/output buffer, which typically operates at 1.5V. 11. How does CKE function? Answer: CKE is the Clock Enable pin. It controls whether the clock is active or not. When CKE is low, the clock is disabled. 12. What is the meaning of DQ0-DQx? Answer: DQ0-DQx represent the Data Input/Output lines, used for transferring data between the memory and the memory controller. 13. What does VSS stand for? Answer: VSS stands for Ground, which is the reference voltage level (typically 0V) for the device. 14. Can the K4A4G165WF-BCTD be used in overclocking applications? Answer: Yes, the K4A4G165WF-BCTD is designed for high-speed applications, and its performance can be optimized in overclocking scenarios within safe voltage and temperature limits. 15. What is the data transfer rate of this module? Answer: The K4A4G165WF-BCTD operates at a data transfer rate of 1600 MT/s. 16. Is there a maximum memory capacity per module for this part? Answer: Yes, it can support a maximum capacity of 4GB per module. 17. What are the applications of K4A4G165WF-BCTD? Answer: The K4A4G165WF-BCTD is used in desktop computers, laptops, and servers for high-speed memory. 18. How do I handle power down states in this module? Answer: When not in use, the memory module can enter a low-power state by disabling the CKE pin. 19. What is the thermal management requirement for K4A4G165WF-BCTD? Answer: It is important to maintain proper heat dissipation and ensure that the memory module operates within the recommended temperature range. 20. How do I configure the BA pins? Answer: The BA pins (e.g., BA0, BA1, BA2) select which memory bank is accessed during memory read/write operations.I hope this information provides clarity on the K4A4G165WF-BCTD specifications! If you need more details, feel free to ask.